Advanced SPICE Modeling Platform
Full SPICE modeling capabilities for characterization, auto model extraction and parameter optimization
Meeting various baseband modeling requirements including electrical, physical, layout, etc.
Built-in parallel SPICE engine, supporting latest CMC industry-standard SPICE model, Verilog-A and sub-circuit models
Applied in various technology nodes including 28nm/14nm/10nm/7nm/5nm/3nm
Adopted by leading customers for process development and IC design
Technology & market leader
for SPICE modeling
Adopted by
leading semiconductor companies worldwide
Meeting various baseband modeling requirements
electrical, physical, layout, etc.
Covering various device types
compact models, user-defined models, etc.
Applied in various processes
Planar, FinFET, GAA, etc.
Applied in advanced process
down to 7nm/5nm/3nm
Supports high-power device modeling
Supports reliability modeling such as PRI, Agemos
Supports RTN modeling
SPICE modeling
& model library
development
New device
SPICE model
development
Semiconductor
device data
testing
Reliability model
development
& validation