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中文

SPICE Model

Baseband Modeling
? BSIMProPlus

RF Modeling
? MeQLab

Model Extraction Automation
? SDEP

Model QA
? ME-Pro
PDK

PCell Development
? PCellLab

PDK Verification
? PQLab
Standard Cell

Library Characterization
? NanoCell

Library Validation
? LibWiz

Design Environment

Schematic Capture
? NanoDesigner SE

Layout Editor
? NanoDesigner LS

Interactive Physical Verification
? NanoDesigner?iV

Design Optimization
? NanoDesigner?Optimizer
Circuit Simulation

SPICE Simulator
? NanoSpice ? NanoSpice X ? NanoSpice Giga

FastSPICE Simulator
? NanoSpice Pro ? NanoSpice Pro X

Mixed Signal
? NanoSpice MS

Waveform Analysis
? NanoWave
Circuit Analysis

Static and Dynamic Circuit Check
? NanoSpice CCK

Yield Analysis
? NanoYield

Signal Integrity
? NanoSpice?SI

Critical Path Analysis
? PathInspector

Power Device Design Verification
? PTM

Power Distribution Network Analysis

ESD Verification
? ESDi

Circuit Simulation

Digital Simulation
? VeriSim
Standard Cell

Library Characterization
? NanoCell

Library Validation
? LibWiz
Design & Verification

Timing Analysis
? TRASTA

Floor Planning
? NavisPro

Signal Integrity Analysis
? NanoSpice SI

Power Design Analysis
? PTM

ESD Verification
? ESDi

Chip-to-Package Connectivity Verification
? PadInspector

Parametric Testing

Semiconductor Parametric Analyzer
? FS-Pro ? FS800
Noise Measurement

Low Frequency Noise
? 9812DX ? 9812E ? 9813DXC

AC Dynamic Noise
? 9812AC
Integrated Testing

Electrical Parameter Testing Software
? LabExpress

Design & Verification

Home Products Digital Design EDA

Circuit Simulation

Digital Simulation

VeriSim
Standard Cell

Library Characterization

NanoCell

Library Validation

LibWiz
Design & Verification

Timing Analysis

TRASTA

Floor Planning

NavisPro

Signal Integrity Analysis

NanoSpice SI

Power Design Analysis

PTM

ESD Verification

ESDi

Chip-to-Package Connectivity Verification

PadInspector

NanoSpice SI | NavisPro | PadInspector | TRASTA | PTM | ESDi

PTM

Power Device Design Verification

Rdson Extraction Gate Delay Analysis Electro-thermal Analysis

PTM is a suite of tools to enhance the design analysis of power device, recognized and adopted by the top-ranking power device IDMs and Fabless companies. It can extract Rdson with high precision and verify the device's switching behavior, ensuring the product's reliability and lifespan.

Utilizing the edge-based 3D solver, optimizing Rdson and gate delay in power transistor arrays
Verifying current density "hot-spots", checking electro-migration violation
Optimizing layout and pad placement, detecting missing vias and metal current crowding
Extending to power device die, package, and PCB co-simulation, ensuring an optimal thermal performance
Integrated with user-friendly results viewer with cross-linked reports and field views

Download Brochure

Highlights

Accurate

High precision parameter extraction
and optimization
Rich Views

2D view, solver view,
and field view
Layout Optimization

Analyze pad
and via placement
Reliability

Analyze potential issues like electromigration,
overheating failures, etc.
Dynamic Analysis

Simulation based transient
ET analysis
Switching Behaviour

Maximize switching
frequency

Applications

Power device
design analysis(IGBT)
Automotive IC
design analysis
Power IC design analysis (PMIC/
DC-DC converters)
Mixed-signal IC
design analysis
Co-optimization of ET performance(in
Chip/Package/PCB)
High voltage
GAN device
design analysis

Videos

Watch Video

Technical Documents

AppNote

How Electrothermal
Analysis Avoid
Thermal Runaway
in CU-Clip Packages

Success Cases

A leading IDM company adopted Primarius’s PTM platform for design iteration and optimization while developing a power protection chip for USB interfaces and hard disk drives. The chip must accurately sense current and temperature changes during hot swapping and automatically cut off high voltage or high current, making the placement of sensors critical. Using PTM’s electrothermal analysis tools, the customer accurately identified the hotspots of power transistors and optimized the placement of sensors, ensuring reliable over-temperature and over-current protection, which significantly improved the product’s performance and quality.

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